{"id":7598,"date":"2025-09-20T23:45:00","date_gmt":"2025-09-20T23:45:00","guid":{"rendered":"https:\/\/lemonde.express\/osat-market-to-reach-usd-71-44-billion-by-2030-driven-by-demand-for-advanced-packaging-and-testing-services\/"},"modified":"2025-09-21T04:44:58","modified_gmt":"2025-09-21T04:44:58","slug":"osat-market-to-reach-usd-71-44-billion-by-2030-driven-by-demand-for-advanced-packaging-and-testing-services","status":"publish","type":"post","link":"https:\/\/lemonde.express\/en\/osat-market-to-reach-usd-71-44-billion-by-2030-driven-by-demand-for-advanced-packaging-and-testing-services\/","title":{"rendered":"OSAT Market to Reach USD 71.44 Billion by 2030, Driven by Demand for Advanced Packaging and Testing Services"},"content":{"rendered":"<p><br \/>\n<\/p>\n<div>\n<h2><b><span data-contrast=\"auto\">Outsourced Semiconductor Assembly and Test (OSAT) Market Overview<\/span><\/b><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:299,&quot;335559739&quot;:299}\">\u00a0<\/span><\/h2>\n<p><span data-contrast=\"auto\">The <\/span><span data-contrast=\"auto\">outsourced semiconductor assembly and test (OSAT) market <\/span><span data-contrast=\"auto\">plays a critical role in the semiconductor value chain by providing packaging and testing services that enable chipmakers to scale production while managing costs. According to Mordor Intelligence, the <\/span><a href=\"https:\/\/www.mordorintelligence.com\/industry-reports\/osat-market?utm_source=emailwire\" target=\"_blank\" rel=\"noopener\"><b><span data-contrast=\"none\">OSAT market size<\/span><\/b><\/a><span data-contrast=\"auto\"> is valued at USD 47.09 billion in 2025 and is expected to reach USD 71.44 billion by 2030, growing at a CAGR of 8.69%.<\/span><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:240,&quot;335559739&quot;:240}\">\u00a0<\/span><\/p>\n<p><span data-contrast=\"auto\">OSAT providers act as strategic partners for integrated device manufacturers (IDMs) and fabless companies, ensuring timely product delivery, optimized yield, and support for increasingly complex semiconductor designs. The OSAT industry has become essential as the demand for smaller, faster, and more energy-efficient chips grows across consumer electronics, automotive, and industrial applications.<\/span><\/p>\n<h2><b><span data-contrast=\"none\">OSAT Market Key Trends<\/span><\/b><\/h2>\n<p><b><span data-contrast=\"auto\">Rising Semiconductor Content in Vehicles<\/span><\/b><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:299,&quot;335559739&quot;:299}\">\u00a0<\/span><\/p>\n<p><span data-contrast=\"auto\">As more features in vehicles become electronic (electric powertrains, driver assistance systems, infotainment), the semiconductor bill of materials per car is increasing. This is boosting demand for OSAT services that can provide reliable, safety-qualified packaging and testing, especially for power packages and chips like silicon carbide.<\/span><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:299,&quot;335559739&quot;:299}\">\u00a0<\/span><\/p>\n<p><b><span data-contrast=\"auto\">Raising Advanced Packaging &amp; Heterogeneous Integration<\/span><\/b><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:299,&quot;335559739&quot;:299}\">\u00a0<\/span><\/p>\n<p><span data-contrast=\"auto\">There\u2019s growing shift toward complex packaging types such as fan-out wafer-level packaging (FO-WLP), wafer-level packaging (WLP), system-in-package (SiP), and 2.5D\/3D through-silicon via platforms. These packaging options support heterogeneous integration (multiple die, mixing logic\/memory\/RF) and help meet performance demands in AI, high performance computing (HPC), and 5G.<\/span><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:299,&quot;335559739&quot;:299}\">\u00a0<\/span><\/p>\n<p><b><span data-contrast=\"auto\">Testing Services Growing Faster<\/span><\/b><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:299,&quot;335559739&quot;:299}\">\u00a0<\/span><\/p>\n<p><span data-contrast=\"auto\">While packaging remains the larger share of OSAT revenue, the testing segment is expected to grow at a stronger rate. As chips get more complex and reliability becomes more critical (e.g. automotive, safety, industrial), the need for thorough test flows, fault isolation, thermal and structural tests increases.<\/span><\/p>\n<h2><b><span data-contrast=\"auto\">OSAT Market Segmentation<\/span><\/b><\/h2>\n<p><span data-contrast=\"auto\">The<\/span><span data-contrast=\"auto\"> outsourced semiconductor assembly and test services (OSAT) market i<\/span><span data-contrast=\"auto\">s segmented by service type, packaging type, application, technology node, and geography. This detailed breakdown illustrates how OSAT providers serve a wide array of semiconductor applications and customers.<\/span><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:240,&quot;335559739&quot;:240}\">\u00a0<\/span><\/p>\n<p><b><span data-contrast=\"none\">By Service Type<\/span><\/b><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;134245418&quot;:true,&quot;134245529&quot;:true,&quot;335559738&quot;:281,&quot;335559739&quot;:281}\">\u00a0<\/span><\/p>\n<p><b><span data-contrast=\"none\">By Packaging Type<\/span><\/b><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;134245418&quot;:true,&quot;134245529&quot;:true,&quot;335559738&quot;:281,&quot;335559739&quot;:281}\">\u00a0<\/span><\/p>\n<ul>\n<li data-leveltext=\"\uf0b7\" data-font=\"Symbol\" data-listid=\"2\" data-list-defn-props=\"{&quot;335552541&quot;:1,&quot;335559685&quot;:720,&quot;335559991&quot;:360,&quot;469769226&quot;:&quot;Symbol&quot;,&quot;469769242&quot;:[8226],&quot;469777803&quot;:&quot;left&quot;,&quot;469777804&quot;:&quot;\uf0b7&quot;,&quot;469777815&quot;:&quot;hybridMultilevel&quot;}\" data-aria-posinset=\"2\" data-aria-level=\"1\"><span data-contrast=\"auto\">Chip-Scale Package (CSP)<\/span><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:240,&quot;335559739&quot;:240}\">\u00a0<\/span><\/li>\n<\/ul>\n<ul>\n<li data-leveltext=\"\uf0b7\" data-font=\"Symbol\" data-listid=\"2\" data-list-defn-props=\"{&quot;335552541&quot;:1,&quot;335559685&quot;:720,&quot;335559991&quot;:360,&quot;469769226&quot;:&quot;Symbol&quot;,&quot;469769242&quot;:[8226],&quot;469777803&quot;:&quot;left&quot;,&quot;469777804&quot;:&quot;\uf0b7&quot;,&quot;469777815&quot;:&quot;hybridMultilevel&quot;}\" data-aria-posinset=\"3\" data-aria-level=\"1\"><span data-contrast=\"auto\">Quad Flat \/ Dual-Inline (QFP\/DIP)<\/span><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:240,&quot;335559739&quot;:240}\">\u00a0<\/span><\/li>\n<\/ul>\n<ul>\n<li data-leveltext=\"\uf0b7\" data-font=\"Symbol\" data-listid=\"2\" data-list-defn-props=\"{&quot;335552541&quot;:1,&quot;335559685&quot;:720,&quot;335559991&quot;:360,&quot;469769226&quot;:&quot;Symbol&quot;,&quot;469769242&quot;:[8226],&quot;469777803&quot;:&quot;left&quot;,&quot;469777804&quot;:&quot;\uf0b7&quot;,&quot;469777815&quot;:&quot;hybridMultilevel&quot;}\" data-aria-posinset=\"4\" data-aria-level=\"1\"><span data-contrast=\"auto\">Multi-Chip Module (MCM)<\/span><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:240,&quot;335559739&quot;:240}\">\u00a0<\/span><\/li>\n<\/ul>\n<p><b><span data-contrast=\"none\">By Application<\/span><\/b><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;134245418&quot;:true,&quot;134245529&quot;:true,&quot;335559738&quot;:281,&quot;335559739&quot;:281}\">\u00a0<\/span><\/p>\n<p><b><span data-contrast=\"none\">By Technology Node<\/span><\/b><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;134245418&quot;:true,&quot;134245529&quot;:true,&quot;335559738&quot;:281,&quot;335559739&quot;:281}\">\u00a0<\/span><\/p>\n<p><b><span data-contrast=\"none\">By Geography<\/span><\/b><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;134245418&quot;:true,&quot;134245529&quot;:true,&quot;335559738&quot;:281,&quot;335559739&quot;:281}\">\u00a0<\/span><\/p>\n<p><b><span data-contrast=\"auto\">Explore Our Full Library of Technology, Media and Telecom Research Industry Reports \u2013<\/span><\/b> <a href=\"https:\/\/www.mordorintelligence.com\/market-analysis\/technology-media-and-telecom?utm_source=emailwire\" target=\"_blank\" rel=\"noopener\"><span data-contrast=\"none\">https:\/\/www.mordorintelligence.com\/market-analysis\/technology-media-and-telecom?utm_source=emailwire<\/span><\/a><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:240,&quot;335559739&quot;:240}\">\u00a0<\/span><\/p>\n<h2><b><span data-contrast=\"none\">Key Players in the OSAT Industry<\/span><\/b><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;134245418&quot;:true,&quot;134245529&quot;:true,&quot;335559738&quot;:299,&quot;335559739&quot;:299}\">\u00a0<\/span><\/h2>\n<p><span data-contrast=\"auto\">Several global players dominate the <\/span><span data-contrast=\"auto\">OSAT industry,<\/span><span data-contrast=\"auto\"> providing specialized services that enable semiconductor companies to meet growing end-market demands. These firms continue to expand capacity, invest in new packaging technologies, and strengthen global networks.<\/span><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:240,&quot;335559739&quot;:240}\">\u00a0<\/span><\/p>\n<ul>\n<li data-leveltext=\"\uf0b7\" data-font=\"Symbol\" data-listid=\"6\" data-list-defn-props=\"{&quot;335552541&quot;:1,&quot;335559685&quot;:720,&quot;335559991&quot;:360,&quot;469769226&quot;:&quot;Symbol&quot;,&quot;469769242&quot;:[8226],&quot;469777803&quot;:&quot;left&quot;,&quot;469777804&quot;:&quot;\uf0b7&quot;,&quot;469777815&quot;:&quot;hybridMultilevel&quot;}\" data-aria-posinset=\"1\" data-aria-level=\"1\"><b><span data-contrast=\"auto\">ASE Technology Holding Co. Ltd<\/span><\/b><span data-contrast=\"auto\"> \u2013 The largest OSAT service provider globally, with strong expertise in advanced packaging and SiP technologies.<\/span><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:240,&quot;335559739&quot;:240}\">\u00a0<\/span><\/li>\n<\/ul>\n<ul>\n<li data-leveltext=\"\uf0b7\" data-font=\"Symbol\" data-listid=\"6\" data-list-defn-props=\"{&quot;335552541&quot;:1,&quot;335559685&quot;:720,&quot;335559991&quot;:360,&quot;469769226&quot;:&quot;Symbol&quot;,&quot;469769242&quot;:[8226],&quot;469777803&quot;:&quot;left&quot;,&quot;469777804&quot;:&quot;\uf0b7&quot;,&quot;469777815&quot;:&quot;hybridMultilevel&quot;}\" data-aria-posinset=\"2\" data-aria-level=\"1\"><b><span data-contrast=\"auto\">Amkor Technology Inc.<\/span><\/b><span data-contrast=\"auto\"> \u2013 Known for its broad service portfolio across automotive, consumer electronics, and communications markets.<\/span><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:240,&quot;335559739&quot;:240}\">\u00a0<\/span><\/li>\n<\/ul>\n<ul>\n<li data-leveltext=\"\uf0b7\" data-font=\"Symbol\" data-listid=\"6\" data-list-defn-props=\"{&quot;335552541&quot;:1,&quot;335559685&quot;:720,&quot;335559991&quot;:360,&quot;469769226&quot;:&quot;Symbol&quot;,&quot;469769242&quot;:[8226],&quot;469777803&quot;:&quot;left&quot;,&quot;469777804&quot;:&quot;\uf0b7&quot;,&quot;469777815&quot;:&quot;hybridMultilevel&quot;}\" data-aria-posinset=\"3\" data-aria-level=\"1\"><b><span data-contrast=\"auto\">Powertech Technology Inc.<\/span><\/b><span data-contrast=\"auto\"> \u2013 Focused on memory and logic packaging solutions, with a strong presence in Asia.<\/span><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:240,&quot;335559739&quot;:240}\">\u00a0<\/span><\/li>\n<\/ul>\n<ul>\n<li data-leveltext=\"\uf0b7\" data-font=\"Symbol\" data-listid=\"6\" data-list-defn-props=\"{&quot;335552541&quot;:1,&quot;335559685&quot;:720,&quot;335559991&quot;:360,&quot;469769226&quot;:&quot;Symbol&quot;,&quot;469769242&quot;:[8226],&quot;469777803&quot;:&quot;left&quot;,&quot;469777804&quot;:&quot;\uf0b7&quot;,&quot;469777815&quot;:&quot;hybridMultilevel&quot;}\" data-aria-posinset=\"4\" data-aria-level=\"1\"><b><span data-contrast=\"auto\">ChipMOS Technologies Inc.<\/span><\/b><span data-contrast=\"auto\"> \u2013 Specializes in IC testing and assembly services for display drivers and memory products.<\/span><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:240,&quot;335559739&quot;:240}\">\u00a0<\/span><\/li>\n<\/ul>\n<ul>\n<li data-leveltext=\"\uf0b7\" data-font=\"Symbol\" data-listid=\"6\" data-list-defn-props=\"{&quot;335552541&quot;:1,&quot;335559685&quot;:720,&quot;335559991&quot;:360,&quot;469769226&quot;:&quot;Symbol&quot;,&quot;469769242&quot;:[8226],&quot;469777803&quot;:&quot;left&quot;,&quot;469777804&quot;:&quot;\uf0b7&quot;,&quot;469777815&quot;:&quot;hybridMultilevel&quot;}\" data-aria-posinset=\"5\" data-aria-level=\"1\"><b><span data-contrast=\"auto\">King Yuan Electronics Co. Ltd<\/span><\/b><span data-contrast=\"auto\"> \u2013 A leading testing service provider supporting a wide range of semiconductor applications.<\/span><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:240,&quot;335559739&quot;:240}\">\u00a0<\/span><\/li>\n<\/ul>\n<p><span data-contrast=\"auto\">These companies are critical to the <\/span><span data-contrast=\"auto\">OSAT market growth<\/span><span data-contrast=\"auto\">, ensuring timely access to high-quality assembly and testing capabilities for semiconductor manufacturers worldwide.<\/span><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:240,&quot;335559739&quot;:240}\">\u00a0<\/span><\/p>\n<p><b><span data-contrast=\"none\">Explore more insights on OSAT market competitive landscape: <\/span><\/b><a href=\"https:\/\/www.mordorintelligence.com\/industry-reports\/osat-market\/companies?utm_source=emailwire\" target=\"_blank\" rel=\"noopener\"><span data-contrast=\"none\">https:\/\/www.mordorintelligence.com\/industry-reports\/osat-market\/companies?utm_source=emailwire<\/span><\/a><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:240,&quot;335559739&quot;:240}\">\u00a0<\/span><\/p>\n<h3><b><span data-contrast=\"none\">Conclusion<\/span><\/b><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;134245418&quot;:true,&quot;134245529&quot;:true,&quot;335559738&quot;:299,&quot;335559739&quot;:299}\">\u00a0<\/span><\/h3>\n<p><span data-contrast=\"auto\">The <\/span><a href=\"https:\/\/www.mordorintelligence.com\/industry-reports\/osat-market?utm_source=emailwire\" target=\"_blank\" rel=\"noopener\"><b><span data-contrast=\"none\">OSAT market<\/span><\/b><\/a><span data-contrast=\"auto\"> is set for continued expansion, supported by the growing demand for advanced packaging, reliable testing services, and outsourcing strategies by semiconductor companies. As chip complexity increases, OSAT providers will remain indispensable partners for the industry, ensuring high performance, quality assurance, and supply chain efficiency.<\/span><\/p>\n<h4><b><span data-contrast=\"none\">Industry Related Reports<\/span><\/b><\/h4>\n<p><a href=\"https:\/\/www.mordorintelligence.com\/industry-reports\/semiconductor-back-end-market?utm_source=emailwire\" target=\"_blank\" rel=\"noopener\"><span data-contrast=\"none\">Semiconductor Back-End Equipment Market<\/span><\/a><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:240,&quot;335559739&quot;:240}\">\u00a0<\/span><\/p>\n<p><span data-contrast=\"auto\">The Semiconductor Back-End Equipment Market Report is Segmented by Equipment Type (Metrology and Inspection, Dicing\/Grinding, and More), Process Stage (Wafer-Level Backend, Assembly and Packaging Stage, Final Test Stage), End-User Type (IDM, Foundry, OSAT), Application Industry (Consumer Electronics, and More), and Geography (North America, South America, and More). The Market Forecasts are Provided in Terms of Value (USD).<\/span><\/p>\n<p><a href=\"https:\/\/www.mordorintelligence.com\/industry-reports\/semiconductor-industry-landscape?utm_source=emailwire\" target=\"_blank\" rel=\"noopener\"><span data-contrast=\"none\">Semiconductor Industry<\/span><\/a><span data-contrast=\"auto\">\u00a0<\/span><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:240,&quot;335559739&quot;:240}\">\u00a0<\/span><\/p>\n<p><span data-contrast=\"auto\">Semiconductor Industry Market is Segmented by Semiconductor Devices (Discrete Semiconductors, Optoelectronics, and More), Technology Node (28nm), Business Model (IDM, and Design\/ Fabless Vendor), End-User Industry (Automotive, Communication (Wired and Wireless), Consumer, Industrial, and More), and Geography (North America, South America, Europe, Asia-Pacific, and Middle East and Africa).<\/span><\/p>\n<p><a href=\"https:\/\/www.mordorintelligence.com\/industry-reports\/semiconductor-bonding-equipment-market?utm_source=emailwire\" target=\"_blank\" rel=\"noopener\"><span data-contrast=\"none\">Semiconductor Bonding Equipment Market<\/span><\/a><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;335559738&quot;:240,&quot;335559739&quot;:240}\">\u00a0<\/span><\/p>\n<p><span data-contrast=\"auto\">The Semiconductor Bonding Equipment Market Report is Segmented by Equipment Type (Permanent, Temporary, and Hybrid), Application (Advanced Packaging, Power IC and Discrete, and More), Bonding Technology (Thermocompression, Eutectic\/Solder, and More), Wafer Size (\u2264200mm, and More), End User (IDMs, Foundries, and OSAT), and Geography (North America, Europe, and More). The Market Forecasts are Provided in Terms of Value (USD).<\/span><\/p>\n<h4><b><span data-contrast=\"none\">About Mordor Intelligence:<\/span><\/b><\/h4>\n<p><span data-contrast=\"none\">Mordor Intelligence is a trusted partner for businesses seeking comprehensive and actionable market intelligence. Our global reach, expert team, and tailored solutions empower organizations and individuals to make informed decisions, navigate complex markets, and achieve their strategic goals. <\/span><\/p>\n<p><span data-contrast=\"none\">With a team of over 550 domain experts and on-ground specialists spanning 150+ countries, Mordor Intelligence possesses a unique understanding of the global business landscape. This expertise translates into comprehensive syndicated and custom research reports covering a wide spectrum of industries, including aerospace &amp; defense, agriculture, animal nutrition and wellness, automation, automotive, chemicals &amp; materials, consumer goods &amp; services, electronics, energy &amp; power, financial services, food &amp; beverages, healthcare, hospitality &amp; tourism, information &amp; communications technology, investment opportunities, and logistics.<\/span><span data-ccp-props=\"{&quot;134233117&quot;:false,&quot;134233118&quot;:false,&quot;201341983&quot;:0,&quot;335551550&quot;:6,&quot;335551620&quot;:6,&quot;335559685&quot;:0,&quot;335559737&quot;:0,&quot;335559738&quot;:240,&quot;335559739&quot;:240,&quot;335559740&quot;:279}\">\u00a0<\/span><\/p>\n<h4><b><span data-contrast=\"none\">For any inquiries or to access the full report, please contact:\u00a0<\/span><\/b><span data-ccp-props=\"{&quot;335559685&quot;:0}\">\u00a0<\/span><\/h4>\n<p><a href=\"https:\/\/marketpresswire.com\/osat-market-to-reach-usd-71-44-billion-by-2030-driven-by-demand-for-advanced-packaging-and-testing-services\/mailto:media@mordorintelligence.com\" target=\"_blank\" rel=\"noopener\"><b><span data-contrast=\"none\">media@mordorintelligence.com<\/span><\/b><\/a><br \/><a href=\"https:\/\/www.mordorintelligence.com\/\" target=\"_blank\" rel=\"noopener\"><b><span data-contrast=\"none\">https:\/\/www.mordorintelligence.com\/<\/span><\/b><\/a><span data-ccp-props=\"{&quot;335559685&quot;:0}\">\u00a0<\/span><\/p>\n<p><b><span data-contrast=\"none\">Mordor Intelligence, 11th Floor, Rajapushpa Summit, Nanakramguda Rd, Financial District, Gachibowli, Hyderabad, Telangana \u2013 500032, India<\/span><\/b><span data-ccp-props=\"{&quot;335559685&quot;:0}\">\u00a0<\/span><\/p>\n<\/p><\/div>\n<p><br \/>\n<br \/><a href=\"https:\/\/marketpresswire.com\/osat-market-to-reach-usd-71-44-billion-by-2030-driven-by-demand-for-advanced-packaging-and-testing-services\/\" target=\"_blank\" rel=\"noopener\">Source link <\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Outsourced Semiconductor Assembly and Test (OSAT) Market Overview\u00a0 The outsourced semiconductor assembly and test (OSAT) market plays a critical role in the&hellip;<\/p>\n","protected":false},"author":1,"featured_media":7599,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_lmt_disableupdate":"","_lmt_disable":"","footnotes":""},"categories":[22],"tags":[2227,2228,2229,2230,2231,2232,2233],"class_list":["post-7598","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-press-releases","tag-osat-industry","tag-osat-market","tag-osat-market-analysis","tag-osat-market-growth","tag-osat-market-overview","tag-osat-market-share","tag-osat-market-size"],"_links":{"self":[{"href":"https:\/\/lemonde.express\/en\/wp-json\/wp\/v2\/posts\/7598","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/lemonde.express\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/lemonde.express\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/lemonde.express\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/lemonde.express\/en\/wp-json\/wp\/v2\/comments?post=7598"}],"version-history":[{"count":0,"href":"https:\/\/lemonde.express\/en\/wp-json\/wp\/v2\/posts\/7598\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/lemonde.express\/en\/wp-json\/wp\/v2\/media\/7599"}],"wp:attachment":[{"href":"https:\/\/lemonde.express\/en\/wp-json\/wp\/v2\/media?parent=7598"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/lemonde.express\/en\/wp-json\/wp\/v2\/categories?post=7598"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/lemonde.express\/en\/wp-json\/wp\/v2\/tags?post=7598"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}